As a major part of network transmission, wireless router needs to provide strong network transmission speed, so it generates a lot of heat. If the heat of router is too high, it will affect the wireless signal, such as signal instability or network disconnection.

Thermal conductive silica gel sheet

In order to solve the problem of heat dissipation and stability of the router, engineers usually use thermal conductive silicon film combined with the shell for heat dissipation in the thermal design of the router. Generally, routers use passive cooling, that is, through the body cooling holes, the cooling fins near the motherboard and the cooling pad. When we choose the heat sink gasket, we should determine the size and thermal conductivity of the thermal conductive silicon film according to the specific heat source (such as CPU and memory).

Therefore, we recommend the thermal conductive silica gel sheet for router heat dissipation. The material has high compression force, and it is sticky. It does not need to use additional adhesive, and it can be used in a variety of thicknesses.

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Product characteristics of thermal conductive silica gel sheet

1 ● various thickness options are available. ●

2 ● with self-adhesive without additional surface adhesive. ●

3 ● good thermal conductivity: 1.5-13w/mk. ●

4. Compressible, soft and elastic in low pressure environment. ●

In the main chip area of the router, there are shielding problems besides heat dissipation. Shielding is mainly covered with shields above the chip, and thermal conductive gels are usually added between the shield and the chip to fill the gap.

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Characteristics of thermal conductive gel products

Low thermal impedance, long-term reliability. ●

2 ● soft, almost no pressure with the device

3 ● good thermal conductivity: 1.5-6.0w/mk. ●

4. It can be easily used for automatic operation of dispensing system. ●

Introduction of thermal conductive gel product parameters

Introduction of product parameters of thermal conductive silica gel sheet